张凯 教授

作者: 时间:2019-05-30 点击数:



一、个人简述

香港科技大学博士,曾任西安交通大学副教授,香港科技大学副研究员、访问学者,现任广东工业大学“百人计划”特聘教授,“省部共建精密电子制造技术与装备国家重点实验室”核心成员。在半导体封装及散热管理、石墨烯等纳米材料及新能源应用、微电子制造工艺及可靠性分析等领域拥有十几年专业经验。承担国家自然科学基金面上项目、广东省科技计划项目、香港创新科技署科技合作项目等,具有丰富的科研、技术转移及产业合作经验。

二、学科领域

新能源车载功率半导体封装,LED固态照明封装、车灯设计及散热管理,石墨烯等纳米材料及其在强化传热和新能源中的应用,有限元、分子动力学仿真等。

三、教育背景

2003.08-2008.08 香港科技大学,机械工程,哲学博士学位;

1993.09-1996.06 西安交通大学,热能工程,工学硕士学位;

1987.09-1991.07 西安交通大学,电厂热能动力工程,工学学士学位。

四、工作经历

2016.08-至今 广东工业大学,“百人计划”特聘教授

2008.09-2016.07 香港科技大学,副研究员/访问学者

1991.07-2016.07 西安交通大学,助教、讲师、副教授

五、学术兼职

国际著名期刊审稿人:Carbon, Thermochimica Acta, Computational Materials Science, Journal of Experimental Nanoscience, International Journal of Heat and Mass Transfer, IEEE transactions on Components, Packaging and Manufacturing Technology, Journal of Nanomaterials等

六、主要荣誉

  1. 2017年广东工业大学先进科技工作者

  2. 第12届电子封装技术国际会议 (ICEPT), 飞利浦杰出论文奖,

  3. 第7届电子封装技术国际会议 (ICEPT), 飞利浦最佳论文奖,

  4. 第55届电子元件技术国际会议 (ECTC),摩托罗拉/ IEEE元件封装与制造技术学会CPMT研究生奖。

七、代表性论文

  1. Li, Chu; Tao, Ran; Luo, Shuang; Gao, Xiang;Zhang, Kai*; Li, Zhigang*,“Enhancing and Impeding Heterogeneous Ice Nucleation through Nanogrooves”,The Journal of Physical Chemistry

  2. Kai Zhang*, Guowei David Xiao, Zhaoming Zeng, Chuiming Wan, Jie Li, Shihan Xin, Xiaowu He, Shaojia Deng, Yu Zhang, Chengqiang Cui, Yunbo He, Lisa Liu, Cheng Sheng Ku, Matthew M. F. Yuen, A novel thermally conductive transparent die attach adhesive for high performance LEDs, Materials Letters, 235 (2019) 216-219

  3. Huiru Yang, Zeping Wang, Huaiyu Ye,Kai Zhang*, Xianping Chen, Guoqi Zhang, Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study, Applied Surface Science 459 (2018) 554-561

  4. Bin Yang, Chengqiang Cui, Yu Zhang,Kai Zhang*, Zhangqiao Zhou, Xun Chen, Xin Chen, Jian Gao, Yunbo He, Hui Tang and Yun, “New Surface Treatment Method for Silver Alloy Wire and Its Performance Evaluation”, 19th International Conference on Electronic Packaging Technology (ICEPT), pp.1237-1240, Shanghai, China, 8-11 Aug., 2018

  5. Kai Zhang*, Jie Li, et al, “Highly Thermal Conductive Transparent Die Attach Material for LEDs”, 17th Electronic Packaging Technology Conference (EPTC), Singapore, 2-4 Dec., 7412390, 2015, oral presented

  6. Sheng-Yun Huang, Bo Zhao,Kai Zhang, et al, “Enhanced reduction of graphene oxide on recyclable copper foils to fabricate graphene films with superior thermal conductivity”, Scientific Reports 5, Article number: 14260, 2015

  7. Zhaoli Gao, Xinfeng Zhang,Kai Zhang, et al, "Growth of Vertically Aligned Carbon Nanotube Arrays on Al Substrates Through Controlled Catalyst Diffusion", The Journal of Physical Chemistry C, Vol. 119, pp.15636-15642, 2015

  8. Jie Li, Kai Zhang*, Xinfeng Zhang, Matthew Ming-Fai Yuen, Lisa Liu, Cheng Sheng Ku, “Enhancing the Thermal Conductivity of Silicone Composites by Increasing Crosslink Degree”, 15th International Conference on Electronic Packaging Technology (ICEPT), pp.329-333, Chengdu China, 12-15 Aug., 2014

  9. Hu-Ming Ren,Kai Zhang, et al, “Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives”, Journal of Solid State Lighting, Vol.1, Article No.10, 2014

  10. Sheng-Yun Huang,Kai Zhang, et al, “Facile synthesis of flexible graphene-silver composite papers with promising electrical and thermal conductivity performances”, RSC Adv., Vol.4, pp.34156-34160, 2014

  11. Zhihua Cao,Kai Zhang, et al, “High Performance Phase Change Thermal Interface Materials Based on Porous Graphitic Carbon Spheres-Paraffin Wax Composite”, 64th IEEE Electronic Components and Technology Conference (ECTC), pp. 464-469, San Diego, CA, USA, 27-30 May, 2014

  12. Kai Zhang*, Xinfeng Zhang, et al, “Thermal improvement of die attach by using PDMS-grafted particles as filler and Its application in solid state lighting”, 14th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.146-152, Wroclaw, Poland, 14-17 April, 2013, oral presented

  13. Xinfeng Zhang,Kai Zhang, et al, “Highly conductive die attach adhesive from percolation control and its applications in light emitting device thermal management”, Appl. Phys. Lett., Vol.102, 014101, 2013

  14. Kai Zhang*, Xinfeng Zhang, et al, “Thermal Improvement of Die Attach with Iodine Treatment and Its Application in Solid State Lighting”, 13th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.231-234, Cascais, Portugal, 16-18 April, 2012, oral presented

  15. Kai Zhang*, David G.W. Xiao, et al, "Novel Cooling Solutions for LED Solid State Lighting”, 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT&HDP), pp.1128-1132, Shanghai, China, 8-11 Aug., 2011, oral presented,Award: Philips Outstanding Paper

  16. Kai Zhang*, Haibo Fan, et al, “Thermal Performance of LED Packages for Solid State Lighting with Novel Cooling Solutions”, 12th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.121, Linz, Austria, 18-20 April, 2011, oral presented,Keynote

  17. Zhaoli Gao,Kai Zhang, et al, “Fabrication of carbon nanotube thermal interface material on aluminum alloy substrates with low pressure CVD”, Nanotechnology, Vol.22, 265611, 2011

  18. Chong Li, Hai-Bo Fan, Kai Zhang, et al, “Flow dependence of interfacial thermal resistance in nanochannels”, Journal of Chemical Physics, Vol.132, 094703, 2010

  19. H.B. Fan,Kai Zhang, et al, “The interfacial thermal conductance between a vertical single-wall carbon nanotube and a silicon substrate”, Journal of Applied Physics, Vol.106, 034307, 2009

  20. Kai Zhang*, Y Chai, Matthew M.F. Yuen, et al, “Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling”, Nanotechnology, Vol.19, 215706, 2008

  21. Kai Zhang*, Matthew M.F. Yuen, et al, “Directly Synthesizing CNT-TIM on Aluminum Alloy Heat sink for HB-LED Thermal Management”, 58th IEEE Electronic Components and Technology Conference (ECTC), pp.1659-1663, Orlando, FL, USA, 27-30 May, 2008, oral presented

  22. Kai Zhang*, Matthew M.F. Yuen, et al, “Fabrication of High Thermal Conductivity Carbon Nanotube Arrays by Self Assembled Fe3O4 particles”, CIRP Annals, Vol.56, pp. 245-248, 2007

  23. Kai Zhang*, Matthew M.F. Yuen, "Heat spreader with aligned CNTs designed for thermal management of HB-LED packaging and microelectronic packaging”, 7th International Conference on Electronic Packaging Technology (ICEPT), pp.479-482, Shanghai, China, 26-29 Aug., 2006, oral presented,Award: Philips Best Paper

  24. Kai Zhang*, Matthew M.F. Yuen, N. Wang, J.Y. Miao, David G.W. Xiao, H.B. Fan, “Thermal Interface Material with Aligned CNT and Its Application in HB-LED Packaging”, 56th IEEE Electronic Components and Technology Conference (ECTC), pp.177-182, San Diego, CA, USA, 30 May-2 June, 2006, oral presented

  25. Kai Zhang*, David G. W. Xiao, Cell K.Y. Wong, H.W. Gu, Matthew M.F. Yuen, Philip C.H. Chan, Bing Xu, “Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High Brightness LED Packaging with Flip Chip”, 55th IEEE Electronic Components and Technology Conference (ECTC), pp.60-65, Orlando, FL, USA, 31 May-4 June, 2005, oral presented,Award: 2005 Motorola/IEEE CPMT Graduate Student Fellowship for Research on Electronic Packaging

八、主要著作

  1. Kai Zhang*, Matthew M.F. Yuen, “Thermal stresses in LED packages for solid state lighting” in book “Encyclopedia of Thermal Stresses”, published by Springer, pp.5378-5394, 2013

  2. H Fan,Kai Zhang, Matthew M.F. Yuen, “Thermal Conductivity of Carbon Nanotube Under External Mechanical Stresses and Moisture by Molecular Dynamics Simulation”, in book “Molecular Modeling and Multiscaling Issues for Electronic Material Applications”, published by Springer, pp.93-99, 2012

九、科研项目

  1. 国家自然科学基金面上项目,第三代半导体封装新型固晶材料的可控制备及微纳尺度热传递机理研究,61874035,2019.01-2022.12,直接经费63.00万元,主持

  2. 广东省科技计划工业高新技术领域项目,第三代半导体封装高温固晶材料及关键技术的研发,2017A010106005,2017.9.1-2020.8.31,80万,主持

  3. 广东省科技计划粤港联合创新领域项目,第三代半导体封装整体散热关键技术的研发,2017A050506053, 2017.10.1-2019.9.30,50万,主持

  4. 广东工业大学“百人计划”(特聘教授)项目,220418106,电子封装、第三代半导体系统及新型材料研究,2016/08-2021/07,100万,主持

  5. 香港创新科技署大学与产业合作计划项目,UIM/241,高导热性能固晶材料及其在LED照明系统中的应用,2013/6/1-2015/8/15,312.8万元港币,主持

  6. 香港创新科技署粤港科技合作计划项目,GHP/035/07GD,大功率 LED 封装材料和制造技术,2008/9/1-2010/8/31,457.9万元港币,主持

  7. 美国电子元件与技术国际会议(ECTC)“Motorola-IEEE/CPMT电子封装”研究生奖金项目,IEEE06/07.EG01,Carbon Nanotube Thermal Interface Material and Its Application in High Brightness LED Packages, 2006/5/1-2008/4/3, 16.4万元港币,主持

十、知识产权

  1. 一种导电聚合物包覆的纳米金属及其制备方法,201810337133.6,中国发明专利

  2. 一种散热器及散热系统,201711387259.6,中国发明专利/201721819607.8,已授权中国实用新型专利

  3. 一种互连技术,201710471203.2,中国发明专利

  4. 一种银键合丝的制备方法,201710413850.8,中国发明专利

  5. 一种互连材料及其制备方法,201710469870.7,中国发明专利

  6. Three-Dimensional Interconnected Porous Graphene-Based Thermal Interface Materials, US9605193,美国发明专利

  7. Heat Dissipation Structure with Aligned Carbon Nanotube Arrays and Methods for Manufacturing and Use, US8890312,美国发明专利

  8. 具有排列整齐的碳纳米管阵列的散热结构及其制造和应用,200710106382.6,中国发明专利

十一、联系方式

办公地点:广东工业大学大学城校园工学2号馆机电工程学院

通信地址:广州市番禺区广州大学城外环西路100号

邮政编码:510006

联系电话:13826291297

电子邮箱: mezhangk@qq.com

院办电话:39322212 学生工作:39322210,39322226 研究生工作:39322226 科研工作:39322209

院长邮箱:jdyb@gdut.edu.cn 管理员邮箱:meetingnotice_gdut@163.com