1.教育与研究经历
教育经历
2006.9-2011.12，广东工业大学，机械制造及其自动化专业，工学博士
1992.9-1995.3，武汉工学院(现: 武汉理工大学)，机械学专业，工学硕士
1988.9-1992.6，天津轻工业学院(现: 天津科技大学)，化工设备与机械专业，工学学士
工作经历
1995-今 广东工业大学，机电工程学院，教师
2.研究方向
博士生导师。长期从事半导体晶圆超精密加工、金属薄板精密剪切等相关领域的研究，目前主要研究方向包括半导体晶圆研磨抛光加工方法与技术、固相反应研磨盘和抛光盘研制、CMP抛光工艺和抛光垫研究等。近年来毕业硕士生绝大多数进入半导体行业工作。
作为项目负责人主持国家自然科学基金面上项目3项，省市级、企业研究项目近10多项。第一作者或通讯作者在国内外学术刊物和会议上发表学术论文70多篇，其中SCI收录论文30多篇，EI收录论文50多篇。授权PCT专利1件、国家发明专利20多件。
3.职务、兼职和荣誉称号
学术兼职
中国机械工程学会生产工程分会委员；
中国机械工程学会生产工程分会光整加工专业委员会委员；
中国机械工业金属切削刀具技术协会切削先进技术研究分会理事。
主要获奖情况
2021.1.15,《高端金属板带精密高效剪切加工关键技术及装备》获2020年度广东省科学技术奖技术发明奖二等奖，评奖单位：广东省科学技术厅，排名: 4/10(校内排第2)
2020.11.20, 《金属板带高精度加工关键技术及装备》获中国机械工业科学技术奖科技进步奖三等奖，评奖单位：中国机械工程学会，排名: 4/10
2020.8, 《光电晶片集群磁流变超光滑平坦化加工技术》获2020年粤港澳大湾区高价值专利培育布局大赛最具投资潜力奖，排名: 5/6
2013.8，论文《电磁流变效应微磨头抛光加工电磁协同作用机理》获2011-2012年度优秀论文一等奖，评奖单位：广东省机械工程学会，排名: 1/3
2011.11, 举办的“2010年中国（国际）光整加工技术学术会议”获 “2006-2011年中国机械工程学会工作成果奖”, 评奖单位：中国机械工程学会, 排名: 2/3
4.主持或参与的主要项目
主持项目：
(1) 国家自然科学基金面上项目：单晶SiC磁流变弹性抛光垫磁控柔性去除-芬顿反应协同抛光机理与关键技术(52475434), 2025.01-2028.12, 48万元, 主持
(2) 国家自然科学基金面上项目：单晶金刚石激光诱导石墨化辅助CMP抛光协同作用机制与关键技术(52175385), 2022.01-2025.12, 58万元, 主持
(3) 广东省自然科学基金面上项目: 单晶SiC磁流变弹性抛光垫制备及磁控-异相芬顿反应抛光机理研究(2023A1515010923), 2023.01-2025.12, 10万元，主持
(4) 广东省自然科学基金面上项目: 单晶金刚石紫外光催化-芬顿反应CMP抛光协同作用机制与关键技术(2022A1515011868), 2022.01-2024.12, 10万元，主持
(5) 国家自然科学基金面上项目： SiC晶片原子级超光滑表面磁流变化学复合抛光加工研究(51375097), 2014.01-2017.12, 80万元, 主持，已结题
(6) 广东省科技计划项目粤港重大专项：电工硅钢板材精密剪切加工技术研究及装备研发(2016A050503043), 2016.01-2018.12, 100万元, 主持，已结题
(7) 广州市产学研协同创新重大专项: 高效节能汽车发动机自动压装与智能检测一体化关键技术及产业化(201508010056), 2015.01-2017.12, 200万元, 主持，已结题
(8) 广东省科技计划项目: 高效节能电磁感应罐身焊缝补涂烘干机组关键技术研发及产业化(2013B090600039), 2015.01-2016.12, 80万元, 主持，已结题
主要参与项目：
(1) 国家自然科学基金-广东联合基金项目: 多场耦合控制磨料状态的新一代光电晶片超光滑平坦化加工理论与关键技术研究(U1801259), 2019.01-2022.12, 255万元, 参加，已结题
(2) 国家自然科学基金面上项目:降减剪切边缘损伤和毛刺的电工硅钢板材精密剪切加工研究(51575112), 2016.01-2019.12, 63万元, 参加，已结题
(3) 国家自然科学基金面上项目: 控制材料应力应变状态的金属板材无毛刺精密分切加工研究(51175090), 2012.01-2015.12, 65万元, 参加，已结题
(4) 国家自然科学基金-广东联合基金项目: 单晶SiC 基片高效超精密磨粒加工技术基础研究(U1034006), 2011.01-2014.12, 190万元, 参加，已结题
(5) 国家自然科学基金面上项目: 微光学非球面电磁流变液即效亚毫米微磨头研抛加工研究(50575045), 2006.01-2008.12, 28万元, 参加，已结题
5. 主要论文、著作
[1] Qiang Xiong, Jiabin Lu*, Qiusheng Yan, Wentao Liu, Xinhan Wang, Fenglin Zhang. Tribological behavior of single-crystal diamond in a UV photocatalytic-Fenton composite reaction environment. Wear, 2024, 536-537: 205175
[2] Jiayun Deng, Qiang Xiong, Xiaowei Nie, Qiusheng Yan, Jiyang Cao, Jiabin Lu*. Optimisation of free-abrasive assisted lapping process with vitrified bonded diamond plates for sapphire substrates. Precision Engineering, 2024, 86: 183-194
[3] Wentao Liu, Jiabin Lu*, Qiang Xiong, Xinhan Wang, Qiusheng Yan. Investigation on influence of polishing disc materials in UV-catalytic polishing of single crystal diamond. Diamond & Related Materials, 2024, 141: 110678
[4] Da Hu, Jiabin Lu*, Qiusheng Yan, Huilong Li, Jiyang Cao. Study of catalytic properties and grinding performance of single-crystal SiC heterogeneous Fenton reaction grinding discs. International Journal of Advanced Manufacturing Technology, 2024, 133: 2551–2563
[5] Ziyuan Luo, Jiabin Lu*, Jun Zeng, Xinhan Wang, Qiusheng Yan. Experimental study on single crystal diamond CMP based on Fenton reaction and analysis of oxidation mechanism. Materials Science in Semiconductor Processing, 2024, 182: 108739
[6] Ziyuan Luo, Jiabin Lu*, Da Hu, Qiusheng Yan. Influence of SiO2-ZnO mixed soft abrasive on tribological behavior and polishing performance of sapphire wafer. Materials Science in Semiconductor Processing, 2024, 176: 108318
[7] Da Hu, Jiabin Lu*, Qiusheng Yan, Yingrong Luo, Ziyuan Luo. Investigating surface wear characteristics of single-crystal SiC based on metal electrochemical corrosion. Materials Science in Semiconductor Processing, 2024, 171: 108004
[8] 胡达, 路家斌*, 阎秋生, 骆应荣, 雒梓源. 基于金属电化学腐蚀的单晶SiC表面腐蚀和磨损性能研究. 湖南大学学报(自然科学版), 2024, 51(04): 123-131
[9] Da Hu, Jiabin Lu*, Jiayun Deng, Qiusheng Yan, Haotian Long, Yingrong Luo. The polishing properties of magnetorheological-elastomer polishing pad based on the heterogeneous Fenton reaction of single-crystal SiC. Precision Engineering, 2023, 79: 78-85
[10] Weiming Cai, Jiabin Lu*, Qiang Xiong, Ziyuan Luo, Qiusheng Yan. Tribological behavior of polycrystalline diamond based on photo-Fenton reaction. Diamond & Related Materials, 2023, 140: 110430.
[11] Da Hu, Huilong Li, Jiabin Lu*, Qiusheng Yan, Qiang Xiong, Zhanliang Huang, Fenglin Zhang. Study on heterogeneous Fenton reaction parameters for polishing single-crystal SiC using magnetorheological elastomers polishing pads. Smart Materials and Structures, 2023, 32: 025003
[12] Qiang Xiong, Ziyuan Luo, Qiusheng Yan*, Jiabin Lu**, Jisheng Pan. Influences of process parameters on chemical mechanical polishing effect of ZnGeP2 crystal. Materials Science in Semiconductor Processing, 2023, 162: 107499.
[13] Wentao Liu, Qiang Xiong, Jiabin Lu*, Xinhan Wang, Qiusheng Yan. Tribological behavior of single crystal diamond based on UV photocatalytic reaction. Tribology International, 2022, 175: 107806
[14] Xinhan Wang, Qiang Xiong, Jiabin Lu*, Qiusheng Yan, Wentao Liu. Characterization of Fenton reaction-based material removal on single crystal diamond surface. Diamond & Related Materials, 2022, 129: 109320
[15] Da Hu, Jiayun Deng, Jiabin Lu*, Qiusheng Yan, Canlin Du, Jiyang Cao. A study of the magneto-controlled mechanical properties and polishing performance for single-crystal SiC used as a magnetorheological-elastomer polishing pad. Smart Materials and Structures, 2022, 31: 035021
[16] Jiayun Deng, Jiabin Lu*, Shuai Zeng, Qiang Xiong, Qiusheng Yan*, Jisheng Pan. Preparation and processing properties of magnetically controlled abrasive solidification orientation—solid-phase Fenton reaction lapping-polishing plate for single-crystal 4H-SiC. Surfaces and Interfaces, 2022, 29:101646
[17] Qiang Xiong, Xiaowei Nie, Jiabin Lu*, Qiusheng Yan*, Jiayun Deng. Processing performance of vitrified bonded fixed-abrasive lapping plates for sapphire wafers. International Journal of Advanced Manufacturing Technology, 2022, 123: 1945-1955
[18] Yingrong Luo, Qiang Xiong, Jiabin Lu*, Qiusheng Yan, Da Hu. Chemical mechanical polishing exploiting metal electrochemical corrosion of single-crystal SiC. Materials Science in Semiconductor Processing, 2022, 152: 107067
[19] Jiabin Lu*,Yuanfu Huang, Youzhi Fu, Qiusheng Yan, Shuai Zeng. Synergistic effect of photocatalysis and Fenton on improving the removal rate of 4H-SiC during CMP. ECS Journal of Solid State Science and Technology, 2021, 10: 044001
[20] Jiayun Deng, Jiabin Lu*, Qiusheng Yan*, Jisheng Pan. Basic research on chemical mechanical polishing of single-crystal SiC-Electro-Fenton: Reaction mechanism and modelling of hydroxyl radical generation using condition response modelling. Journal of Environmental Chemical Engineering, 2021, 9: 104954.
[21] Jiayun Deng, Jiabin Lu*, Qiusheng Yan*, Jisheng Pan. Enhancement mechanism of chemical mechanical polishing for single-crystal 6H-SiC based on Electro-Fenton reaction. Diamond & Related Materials, 2021, 111:108147
[22] Jiayun Deng, Jiabin Lu*, Shuai Zeng, Qiusheng Yan*, Jisheng Pan. Processing properties for the Si-face of the 4H-SiC substrates using the magnetically-controlled abrasive solidification orientation–solid-phase Fenton reaction for the fabrication of the lapping–polishing plate. Diamond & Related Materials, 2021,120:108652
[23] Jiayun Deng, Jiabin Lu, Qiusheng Yan*, Qixiang Zhang, Jisheng Pan. Preparation and polishing properties of water-based magnetorheological chemical finishing fluid with high catalytic activity for single-crystal SiC. Journal of Intelligent Material Systems and Structures, 2021,32:1441-1451
[24] Jiayun Deng, Qixiang Zhang, Jiabin Lu*, Qiusheng Yan*, Jisheng Pan, Run Chen. Prediction of the surface roughness and material removal rate in chemical mechanical polishing of single-crystal SiC via a back-propagation neural network. Precision Engineering, 2021, 72: 102–110
[25] Qiang Xiong, Jiabin Lu*, Qiusheng Yan*, Jisheng Pan. Edge burr development when using a cemented carbide micro-drill: Formation and control mechanisms. Precision Engineering, 2021, 72: 192–204
[26] Qixiang Zhang, Jisheng Pan*, Xiaowei Zhang, Jiabin Lu, Qiusheng Yan. Tribological behavior of 6H-SiC wafers in different chemical mechanical polishing slurries. Wear, 2021, 472-473.
[27] Jiayun Deng, Qiusheng Yan*, Jiabin Lu*, Qiang Xiong, Jisheng Pan. Optimisation of lapping process parameters for single-crystal 4H-SiC using orthogonal experiments and grey relational analysis. Micromachines, 2021, 12: 910
[28] Qiang Xiong, Qiusheng Yan*, Jiabin Lu, Jisheng Pan. The effects of grinding process parameters of a cemented carbide micro-drill on cutting edge burr formation. The International Journal of Advanced Manufacturing Technology, 2021, 117: 3041-3051
[29] Jun Zeng, Jiabin Lu*, Zhihao Gao, Qiusheng Yan. Formation mechanism for edge of disc cutter made of WC/Co cemented carbide. International Journal of Abrasive Technology, 2020, 10: 44-61
[30] Canming Wang*, Qiusheng Yan, Jiabin Lu, Xiaowei Zhang. Influence of guillotine clearance on cut-edge damage to nonoriented electrical steel. Journal of Materials Engineering and Performance, 2020,29:573-581
[31] Qiusheng Yan, Xin Wang, Qiang Xiong, Jiabin Lu*, Botao Liao. The influences of technological parameters on the ultraviolet photocatalytic reaction rate and photocatalysis- assisted polishing effect for SiC. Journal of Crystal Growth, 2020, 531: 125379
[32] Yiwei Zhu, Qiusheng Yan*, Jiabin Lu. Deformation characteristics and grain size effect of thin silicon steel sheet during shearing. Machining Science and Technology, 2020, 24: 544-568
[33] Yiwei Zhu, Qiusheng Yan*, Jiabin Lu. Fault diagnosis method for disc slitting machine based on wavelet packet transform and support vector machine. International Journal of Computer Integrated Manufacturing, 2020, 33: 1118-1128
[34] Huazhuo Liang, Qiusheng Yan, Jiabin Lu*, Bin Luo, Xiaolan Xiao. Material removal mechanisms in chemical-magnetorheological compound finishing. International Journal of Advanced Manufacturing Technology, 2019, 103: 1337–1348
[35] Huazhuo Liang, Jiabin Lu*, Jisheng Pan*, Qiusheng Yan. Material removal process of single-crystal SiC in chemical-magnetorheological compound finishing. International Journal of Advanced Manufacturing Technology, 2018, 94: 2939-2948
[36] Huazhuo Liang, Jiabin Lu*, Qiusheng Yan. Catalysts based on Fenton reaction for SiC wafer in chemical magnetorheological finishing. AIMS Materials Science, 2018,5: 1112– 1123.
[37] Huazhuo Liang, Jiabin Lu*, Qiusheng Yan, Tao Song. Chemical catalysts of Fenton reaction for single-crystal SiC based on nanoindentation. International Journal of Abrasive Technology, 2018,8: 232-244
[38] Jiabin Lu*, Run Chen, Huazhuo Liang, Qiusheng Yan. The influence of concentration of hydroxyl radical on the chemical mechanical polishing of SiC wafer based on the Fenton reaction. Precision Engineering, 2018,52: 221-226
[39] Qiusheng Yan, Zhihui Kuang, Jiabin Lu*. Effect of AlTiN-coating oblique guillotine tools on their performance when shearing electrical steel sheets. International Journal of Advanced Manufacturing Technology, 2018,99: 819-831
[40] Jiabin Lu*, Qiusheng Yan, Hong Tian, Lingye Kong. Polishing properties of tiny grinding wheel based on Fe3O4 electrorheological fluid. Journal of Materials Processing Technology, 2009, 209: 4954-4957
[41] Jiabin Lu*, Qiusheng Yan, Juan Yu, Weiqiang Gao. Parametric study of micro machining with instantaneous tiny-grinding wheel based on the magnetorheological effect of abrasive slurry. International Journal of Materials and Product Technology, 2008, 31: 113-124
[42] 阎秋生*, 廖博涛, 路家斌, 付有志. 集群磁流变变间隙动压平坦化加工试验研究. 机械工程学报, 2021,57:230-238
[43] 路家斌*，曾帅，阎秋生，熊强，邓家云. 基于磁控磨料定向的SiC固相芬顿反应研抛盘制备及性能研究. 表面技术, 2021,50: 353-362
[44] 付有志, 路家斌*, 阎秋生, 谢殿华. 磁流变动压复合抛光基本原理及力学特性. 表面技术, 2020,49: 55-63
[45] 路家斌，熊强，阎秋生*，王鑫，廖博涛. 紫外光催化辅助SiC抛光过程中化学反应速率的影响. 表面技术, 2019,48: 148-158.
[46] 徐少平, 路家斌*, 阎秋生, 宋涛, 潘继生. 单晶SiC化学机械抛光液的固相催化剂研究. 机械工程学报, 2017, 53: 167-173
[47] 路家斌*, 曾军, 阎秋生. 圆盘剪分切断面形貌形成机理研究. 机械工程学报, 2014, 50: 178-185
[48] 潘继生, 阎秋生, 路家斌, 徐西鹏, 陈森凯. 集群磁流变平面抛光加工技术. 机械工程学报, 2014, 50: 205-212
[49] 路家斌*, 潘嘉强, 阎秋生. 不锈钢薄板圆盘剪分切过程有限元仿真研究. 机械工程学报, 2013, 49: 190-198
[50] 路家斌*, 阎秋生, 潘继生, 高伟强. 电磁流变效应微磨头加工电磁耦合协同作用机理实验. 光学 精密工程, 2012, 20: 2485-2491
[51] 路家斌*, 阎秋生, 田虹, 高伟强.. 电磁流变效应微磨头抛光加工电磁协同作用机理. 摩擦学学报, 2010, 30: 190-196
6. 主要授权发明专利
[1] 熊强, 路家斌, 阎秋生, 骆应荣, 胡达. 一种半导体晶片磁控研磨和抛光一体盘及其使用方法, PCT专利, PCT/CN2022/142290, 授权时间: 2023.03.15
[2] 路家斌; 胡达; 胡增权; 梁文锐; 黄梓荣; 龙浩天. 一种用于SiC晶片化学机械抛光的磁流变弹性金属接触腐蚀抛光垫、制备方法及其应用, 发明, ZL202311873185.2, 授权时间: 2024.07.12
[3] 路家斌, 胡达, 龙浩天, 靳宇航, 熊强. 一种用于半导体晶片化学机械抛光的磁流变弹性抛光垫、制备方法及其应用, 发明, ZL202310946782.7, 授权时间: 2024.01.26
[4] 熊强, 路家斌, 阎秋生, 骆应荣, 胡达. 一种半导体晶片磁控研磨和抛光一体盘及其使用方法, 发明, ZL202210769741.0, 授权时间: 2023.04.28
[5] 路家斌, 骆应荣, 熊强, 阎秋生, 王新汉, 刘文涛. 一种抛光液、磷化铟抛光装置及方法, 发明, ZL202210199935.1, 授权时间: 2023.04.11
[6] 路家斌, 胡达, 熊强, 阎秋生, 杜灿林. 一种磁流变弹性体及其制备方法和应用, 发明, ZL202111058349.7 , 授权时间: 2023.07.07
[7] 路家斌, 王新汉, 熊强, 阎秋生, 刘文涛, 骆应荣. 一种金刚石晶片抛光的材料去除率计算方法及系统, 发明, ZL202110930698.7, 授权时间: 2023.02.27
[8] 路家斌, 曾帅, 阎秋生, 潘继生, 聂小威, 陈海阳. 一种适用于SiC晶片的磨粒定向的固相反应研磨盘及其制备方法和应用, 发明, ZL202110286580.5, 授权时间: 2022.12.23
[9] 阎秋生, 郭晓辉, 路家斌, 潘继生. 往复移动滚剪的非晶合金带材横剪加工装置和方法, 发明, ZL202011364883.6, 授权时间: 2022.06.14
[10] 阎秋生, 汤彪, 路家斌, 朱奕玮. 一种通过橡胶圈挤压供油的微沟槽组合圆盘刀, 发明, ZL201811230961.6, 授权时间: 2021.02.09
[11] 阎秋生, 朱奕玮, 路家斌, 汤彪. 一种具有润滑油导流微沟槽的横剪刀, 发明, ZL201811230028.9, 授权时间: 2021.01.05
[12] 路家斌, 梁华卓, 汤彪. 一种凸轮驱动磁体式磁流变流体动压抛光装置及抛光方法, 发明, ZL201710094137.1, 授权时间: 2019.06.14
[13] 肖晓兰, 阎秋生, 潘继生, 路家斌, 陈润, 梁华卓. 一种用于SiC单晶片的磁流变化学机械抛光液及其使用方法, 发明, ZL201610630974.7, 授权时间: 2018.05.15
[14] 路家斌, 梁华卓, 阎秋生, 陈润. 一种半导体基片的流体动压抛光装置及其抛光方法, 发明, ZL201610351953.1, 授权时间: 2018.05.01
[15] 路家斌, 陈润, 阎秋生, 梁华卓, 朱奕玮. 一种自增压高速磨粒磁流孔内表面抛光方法及装置, 发明, ZL201610219339.X, 授权时间: 2018.04.17
[16] 路家斌, 梁华卓, 阎秋生, 陈润. 一种磁流变流体动压复合抛光装置及其抛光方法, 发明, ZL201610352311.3, 授权时间: 2018.04.17
[17] 阎秋生, 曾军, 冯文雅, 路家斌, 潘继生. 金属板材圆盘剪分切加工三向力测量装置及其方法, 发明, ZL201410425021.8, 授权时间: 2017.03.01
[18] 潘继生, 阎秋生, 路家斌. 柔性抛光垫在线修整的超光滑平面研磨抛光装置及方法, 发明, ZL201410424335.6, 授权时间: 2017.01.11
[19] 路家斌, 潘继生, 祝江停, 阎秋生, 徐西鹏. 一种单晶碳化硅晶片的化学集群磁流变复合加工方法, 发明, ZL201210304530.6, 授权时间: 2016.09.21
[20] 潘继生, 陈森凯, 路家斌, 阎秋生. 一种单晶半导体基片的截面快速制作及亚表面微裂纹检测方法, 发明, ZL201310643511.0, 授权时间: 2016.01.20
[21] 潘继生, 阎秋生, 路家斌, 王威. 磁流变效应粘弹性夹持的电瓷基片柔性研抛装置及方法, 发明, ZL201210553510.2, 授权时间: 2015.12.23
7.联系方式
办公地点：广东工业大学工学二号馆709
Tel: 13808824867
E-mail: lujiabin@gdut.edu.cn, 13808824867@139.com
招生名额：每年招收学术博士生1名，工程博士生1名，硕士生（学硕和专硕）5名。
对研究生的要求：主动、勤奋、勤于思索、动手能力强，有志于进入半导体行业的同学。
近几年毕业学生入职单位：华为海思，深圳新凯来，深圳鹏芯微，深圳鹏新旭，武汉长江存储，东莞中稼半导体，广州中航光电，深圳比亚迪半导体，武汉新芯……
